DRD96240-3002 Low-Temperature Potting Compound, Impact-Resistant, Directly Supplied by DADIYUAN Manufacturer—Ideal for Indoor Medium- to High-Voltage Electrical Applications
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Category:
Resin and Adhesive Series
Hotline:
DRD96240-3002 Low-Temperature Potting Compound, Impact-Resistant, Directly Supplied by DADIYUAN Manufacturer—Ideal for Indoor Medium- to High-Voltage Electrical Applications
Key Features
Glass transition temperature Tg (°C) 130
Heat resistance rating is Class H
Product Introduction
Features outstanding heat resistance, low resin system viscosity, a mild exothermic reaction, extended pot life, and minimal shrinkage upon curing.
Performance parameters
96240-3002 is an epoxy potting premix formulated with low-viscosity bisphenol A epoxy resin and a toughened curing agent, manufactured using advanced processing technology. This product is widely suitable for atmospheric or vacuum encapsulation casting of indoor medium- and high-voltage electrical insulation components, including motors, hollow cup motors, small reactors, post insulators, bushings, switchgear parts, current and voltage transformers, and more.
Liquid Component Properties
|
Project |
Component A |
Component B |
|
Appearance (red, black, and white color options available) |
Various viscous liquids |
Yellow, transparent liquid |
|
Model |
96240-3002 |
96240-3002 |
|
Density (g/mL, 25 °C) |
1.6–2.3 |
0.90 - 1.5 |
|
Viscosity (mPa·s, 70 °C) |
500–10,000 |
10 - 400 |
|
Filler Ratio (%) |
55-72 |
|
Solidification Property*
A:B = 100:12 (weight ratio), Curing conditions: 80°C / 1–4 hours (specific curing time depends on the size of the component).
|
Project |
Standard |
Unit |
Metrics |
|
Flame retardancy |
UL94 |
- |
V0 |
|
High-Low Temperature Shock: -60°C to 150°C |
≥4 |
Sky |
≧7 |
|
Tensile strength |
ISO 527 |
MPa |
80–100 |
|
Flexural strength |
ISO 178 |
MPa |
90–130 |
|
Impact strength |
ISO 179 |
kJ/m2 |
11–15 |
|
Electrical Strength (25 °C) |
IEC 60243 |
MV/m |
20-30 |
|
Dissipation factor tanδ (25 °C, 50 Hz) |
IEC 60250 |
% |
0. 1–0.3 |
|
Dielectric constant ε (25 °C, 50 Hz) |
IEC 60250 |
- |
3.0–4.5 |
|
Volume Resistivity (25 °C, 50 Hz) |
IEC 60093 |
Ω·cm |
1015 |
|
Surface resistivity (25 °C, 50 Hz) |
IEC 60093 |
Ω |
1014 |
|
Linear thermal expansion coefficient (?) |
ASTM D696 |
10-6/K |
30-35 |
|
Thermal conductivity (0.8) |
ASTM C177 |
W/(m·K) |
1.0–1.2 |
|
Compared to the electric tracking index |
IEC 60112 |
- |
CTI 600M |
Operating Process
Pouring process
Epoxy resin has strong adhesive properties, so the molding surface should be coated with a release agent (primarily silicone-based) before pouring.
Traditional Atmospheric Pressure Potting and Casting
For manufacturing insulating components—such as motor magnets and motor flat wires—casting can be carried out under normal atmospheric pressure. The fully degassed, thoroughly mixed material is then injected into the mold at ambient temperature and pressure. After casting, the product is transferred to a suitable oven, where it undergoes gelation and curing under standard atmospheric conditions.
Traditional vacuum casting
For the manufacturing of insulating components—such as medium- or high-voltage motor windings, power transformers, and current transformers—the casting process should be carried out in a vacuum environment. The fully degassed mixture is then injected into preheated molds under vacuum conditions. After casting is complete, the products are transferred to an appropriate oven for gelation and curing at standard atmospheric pressure.
Curing conditions
First, the resin begins to react and gel, then solidifies into a block-like structure, ultimately forming a dimensionally stable casting with sufficient strength to allow for…
The outer mold is removed only after the performance shows no significant changes, confirming that the curing process is complete. It’s important to note that the minimum curing temperature and curing time requirements are designed to achieve the highest possible cross-linking density of the resin system—specifically, for 96240-3002, the minimum curing temperature ranges from 70°C to 80°C.
Refer to the curing process: 80°C / 1 hour; however, the final curing process will depend on the size and shape of the customer's product.
Mixing and Application Conditions
Viscosity of A+B mixed adhesive after 12 (5) minutes: 2400 mPa·s (38°C) [2000 mPa·s (25°C)]; self-leveling with excellent flowability.
Viscosity of the A+B mixed adhesive after 60 minutes: 5,800 mPa·s (42°C) [2,700 mPa·s (24°C)]; exhibits excellent self-leveling properties and good flowability.
Process parameters

Figure 2: Viscosity of the 96240-3002 mixture as a function of time at 70°C and ambient temperature (23°C)
Packaging format
Storage Conditions
Component A: 25 kg
Component B: 3 kg
Use safely
When stored under room-temperature, dry conditions, the unopened A and B components have shelf lives of 4 months each.
Important Notes
Unhardened materials must not come into contact with food or food-contact utensils. Additionally, precautions should be taken to prevent unhardened material from touching the skin, as some individuals with sensitive skin may experience adverse reactions. It is generally recommended to wear impermeable rubber or plastic gloves and ensure proper eye protection at all times. After each work session, thoroughly wash your skin with soap and warm water—avoid using solvents. Ensure the workplace is well-ventilated, and refer to the product’s Material Safety Data Sheet for specific safety guidelines and preventive measures.