DRD96240-3557 Low-Temperature Potting Compound: Resistant to Extreme Temperatures, Minimal Shrinkage Upon Curing, Suitable for Ambient-Pressure Potting and Casting
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Category:
Resin and Adhesive Series
Hotline:
DRD96240-3557 Low-Temperature Potting Compound: Resistant to Extreme Temperatures, Minimal Shrinkage Upon Curing, Suitable for Ambient-Pressure Potting and Casting
Key Features
Glass transition temperature Tg (°C) 150
Heat resistance rating is Class H
Product Introduction
Eco-friendly, flame-retardant, room-temperature curing adhesive with low viscosity and excellent flowability, making it easy to penetrate even the tightest gaps in products.
Performance parameters
96240-3557 is a potting compound formulated based on low-viscosity bisphenol epoxy resin and a toughened curing agent, enhanced with an environmentally friendly flame retardant and manufactured using advanced processing technology. This product is widely suitable for atmospheric-pressure potting and encapsulation of indoor medium- and low-voltage electrical insulation components, such as switchgear parts, miniature current transformers, transformers, AC capacitors, electronic controllers, and other electronic components. However, it is not recommended for encapsulating products with elastic or soft housings.
Liquid Component Properties
|
Project |
Component A |
Component B |
|
Appearance (red, black, and white color options available) |
Red (each) viscous liquid |
Brownish transparent liquid |
|
Model |
96240-3557 |
96240-3557 |
|
Density (g/mL, 25 °C) |
1.6–2.3 |
0.90 - 1.5 |
|
Viscosity (mPa·s, 25 °C) |
3000–7000 |
10-2000 |
Solidification Property*
A:B = 100:25 (weight ratio), Curing conditions: 25°C × 5–7 hours or 60°C × 1 hour (specific curing time depends on the size of the component).
|
Project |
Standard |
Unit |
Metrics |
|
Flame retardancy |
UL94 |
- |
V0 |
|
High-Low Temperature Shock: -60°C to 150°C (Not Recommended) |
≥4 |
Sky |
≧7 |
|
Tensile strength |
ISO 527 |
MPa |
80–100 |
|
Flexural strength |
ISO 178 |
MPa |
90–130 |
|
Impact strength |
ISO 179 |
kJ/m2 |
11–15 |
|
Electrical Strength (25 °C) |
IEC 60243 |
MV/m |
20-30 |
|
Dissipation factor tanδ (25 °C, 50 Hz) |
IEC 60250 |
% |
0. 1–0.3 |
|
Dielectric constant ε (25 °C, 50 Hz) |
IEC 60250 |
- |
3.0–4.5 |
|
Volume Resistivity (25 °C, 50 Hz) |
IEC 60093 |
Ω·cm |
1015 |
|
Surface resistivity (25 °C, 50 Hz) |
IEC 60093 |
Ω |
1014 |
|
Linear Coefficient of Thermal Expansion |
ASTM D696 |
10-6/K |
30–35 |
|
Thermal conductivity |
ASTM C177 |
W/(m·K) |
0.5–1.0 |
|
Compared to the electric tracking index |
IEC 60112 |
- |
CTI 600M |
Operating Procedures
I. Preparatory Work
1. The products to be poured or encapsulated must be kept dry and clean.
2. Component A may develop a small amount of sediment if left standing for an extended period. Stir thoroughly before use to ensure uniformity.
3. After weighing out components A and B, to prevent spoilage and contamination by foreign materials, any remaining material must be stored tightly sealed.
4. Pour at room temperature and atmospheric pressure; vacuum pouring is not recommended.
5. When the ambient temperature is below 25°C, low-temperature heating curing is recommended, such as 60°C × 1 hour.
6. Before using a large quantity, first test with a small amount to master the product's application techniques.
2. Pouring and Curing
1. A : B = 100 : 25 (weight ratio).
2. Thoroughly mix A and B for 3–5 minutes; it is recommended to use the mixture within 20 minutes. The more adhesive material you combine, the faster the curing process will be—but this also reduces its working life. Therefore, we suggest preparing small batches multiple times as needed.
3. After pouring, the adhesive will gradually seep into the product's crevices; a second application of adhesive can be performed if necessary.
4. During the curing process, please keep the environment clean to prevent foreign impurities or dust from falling onto the uncured adhesive surface.
5. The cast product must be left to sit until the casting material reaches its optimal strength before reuse (typically requiring about 14 days at room temperature of 25°C, or 1 hour of baking at 60°C followed by 1 day of resting).
Refer to the following curing process: 25°C × 5–7 hours or 60°C × 1 hour. The final curing process will depend on the size and shape of the customer’s product.
Packaging format
Storage Conditions
Component A: 20 kg
Component B: 5 kg
Use safely
When stored under room-temperature, dry conditions, the unopened A and B components have shelf lives of 4 months each.
Important Notes
Unhardened materials must not come into contact with food or food-contact utensils. Additionally, precautions should be taken to prevent unhardened material from touching the skin, as some individuals with sensitive skin may experience adverse reactions. It is generally recommended to wear impermeable rubber or plastic gloves and ensure proper eye protection at all times. After each work session, thoroughly wash your skin with soap and warm water—avoid using solvents. Ensure the workplace is well-ventilated, and refer to the product’s Material Safety Data Sheet for specific safety guidelines and preventive measures.